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Photolithography with DaLI

Highly precise structure edges, fine resolution, small feature sizes, and non-destructive design transfer to the material, made possible with laser lithography, is desired in the fields of material science, quantum devices, microelectronics, MEMS, biophysics, lab-on-a-chip designs, microfluidics, and numerous others.

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With laser lithography various electrodes and other designs can be transferred to a single micro crystal, mono layers and other demanding surfaces. Patterning is often conducted through a combination of multiple technologies e.g. scanning probe lithography, electron beam lithography, and photolithography.

  • Precise, nanometer resolution design with smooth edges and sub micrometer features can be realized using DaLI.
  • Accurate positioning and designs of structures based on targeted object’s (crystal, fiber, flake) position, shape and size are possible — markers or additional alignment features are not required.
  • Candidates and their thickness (crystals, flakes etc.) can be identified and differentiated in situ employing color microscope integrated in DaLI.
  • Successful pattern transfer to substrates without limitation on minimum size.
  • Precise, nanometer resolution design with smooth edges and sub micrometer features can be realized using DaLI.
  • Accurate positioning and designs of structures based on targeted object’s (crystal, fiber, flake) position, shape and size are possible — markers or additional alignment features are not required.
  • Candidates and their thickness (crystals, flakes etc.) can be identified and differentiated in situ employing color microscope integrated in DaLI.
  • Successful pattern transfer to substrates without limitation on minimum size.

Dense PCBs and simple chip designs can both be realized through a combination of lithographic steps and further chemical or other processing steps.

  • Dense PCBs can be realized on industrial standard substrates, and multiple layers designs are possible with precise alignment.
  • Simple silicon chip designs can be tested on whole wafer substrates, as holders can be exchanged for 2” to 4” diameters.
  • Standard photoresist materials for mask-based lithography are supported, offering an option to integrate DaLI into existing prototyping and manufacturing facilities.
  • Further processing steps can be either etching, doping or metalization, depending only on photoresist chemistry, not limited by lithography.
  • Dense PCBs can be realized on industrial standard substrates, and multiple layers designs are possible with precise alignment.
  • Simple silicon chip designs can be tested on whole wafer substrates, as holders can be exchanged for 2” to 4” diameters.
  • Standard photoresist materials for mask-based lithography are supported, offering an option to integrate DaLI into existing prototyping and manufacturing facilities.
  • Further processing steps can be either etching, doping or metalization, depending only on photoresist chemistry, not limited by lithography.

Micro-electromechanical systems (or MEMS) can be designed and prepared through our CAD software combined with DaLI’s nano lithography capabilities.

  • Lithographic structures can be prepared on virtually any material with sufficiently low roughness, either directly or with the help of bonding agents in the form of sputtered thin metal layers or dried chemicals.
  • Lithography serves for either creating a mask for further etching steps (i.e. for silicon-based MEMS) or for direct structuring of thick photoresists, creating mechanical components made of photoresist materials.
  • High precision and repeatability are necessary for reliable micromechanical components, both delivered by DaLI’s acousto-optic deflectors and integrated control systems.
  • High aspect ratio microstructures, such as gears, mixers and valves, can be created through the use of the coarse tool setting, enlarging the vertical reach, but keeping walls smooth.
  • Lithographic structures can be prepared on virtually any material with sufficiently low roughness, either directly or with the help of bonding agents in the form of sputtered thin metal layers or dried chemicals.
  • Lithography serves for either creating a mask for further etching steps (i.e. for silicon-based MEMS) or for direct structuring of thick photoresists, creating mechanical components made of photoresist materials.
  • High precision and repeatability are necessary for reliable micromechanical components, both delivered by DaLI’s acousto-optic deflectors and integrated control systems.
  • High aspect ratio microstructures, such as gears, mixers and valves, can be created through the use of the coarse tool setting, enlarging the vertical reach, but keeping walls smooth.

Behavior of biophysical systems depends on surface characteristics and morphology on which those are built upon.

  • Photoresist materials can either directly serve as a base layer for biophysical experiments, with surfaces modified through lithographic steps, or can be used to emboss the textured surface to other biocompatible materials.
  • Photoresist surface texturing is achieved with precise control of illumination parameters, resulting in various textures exhibiting different physical properties to control flows, biocompatibility, or friction.
  • Lithographic structures in thick photoresists can be designed for controlled bonding applications and inducing topological changes in liquid crystalline materials.
  • Hierarchically organized surface structures and single-micron scale two-dimensional array patterns, both realized in thin photoresists, act as in-vitro simulations of real life complex biological systems.

Miniaturized laboratories, enabling various biological or chemical reactions taking place on a millimeter-to-centimeter scale substrate, are already a staple for in-situ detection methods and diagnostics in remote areas.

  • Multiple laboratory functions need to be integrated on a single lab-on-a-chip device, often combining elements of microfluidics, micromechanical and micro electrical components, thus facilitating the need of controlled centimeter scale structuring with the ability to define micrometer scale details.
  • Highly precise lithographic structures are needed for a high-quality final device, in order to avoid leaks and jams in the contained flows.
  • Non-contact methods of sample mounting, positioning, and structure illumination in DaLI serve to maintain a clean microscale environment.
  • Quick design changes are possible within the DaLI’s software suite, offering a rapid work routine throughout the process of prototyping the desired lab-on-a-chip solution.
  • Multiple laboratory functions need to be integrated on a single lab-on-a-chip device, often combining elements of microfluidics, micromechanical and micro electrical components, thus facilitating the need of controlled centimeter scale structuring with the ability to define micrometer scale details.
  • Highly precise lithographic structures are needed for a high-quality final device, in order to avoid leaks and jams in the contained flows.
  • Non-contact methods of sample mounting, positioning, and structure illumination in DaLI serve to maintain a clean microscale environment.
  • Quick design changes are possible within the DaLI’s software suite, offering a rapid work routine throughout the process of prototyping the desired lab-on-a-chip solution.

Microfluidic channels embossed in PDMS or similar materials can exhibit high-aspect ratios, smooth walls, and well-defined corners, as well as potentially structured walls to manipulate flows of liquids or particles.

  • DaLI’s coarse tool offers higher processing speeds compared to fine tool as a consequence of using a larger laser spot size on material but achieves equally smooth channel wall as well as minimal deviations from vertical sides in case of thick photoresists.
  • Large overall scale, demanded due to necessary connections to external pumps and reservoirs, is quickly achieved with the use of the coarse tool. 
  • Large scale structures and single-micrometer scale channels are seamlessly connected with automated stitching and tool changes in DaLI through integrated software and hardware capabilities.
  • DaLI’s coarse tool offers higher processing speeds compared to fine tool as a consequence of using a larger laser spot size on material but achieves equally smooth channel wall as well as minimal deviations from vertical sides in case of thick photoresists.
  • Large overall scale, demanded due to necessary connections to external pumps and reservoirs, is quickly achieved with the use of the coarse tool. 
  • Large scale structures and single-micrometer scale channels are seamlessly connected with automated stitching and tool changes in DaLI through integrated software and hardware capabilities.

Universality is enabled with the use of both special positive photoresists, where channels can be directly shaped into photoresist, and negative photoresists — all supported by DaLI’s laser lithography functionalities.

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    Would you like to collaborate with us on a lithographic project of your interest? Please, do not hesitate to contact us

      This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

      Would you like to collaborate with us on a lithographic project of your interest? Please, do not hesitate to contact us

        This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.